Publications Related to Silicon Photonic Devices for High Throughput Transmission Links

D. Nikolova, K. Bergman, "Silicon photonic interconnection networks in high performance datacom systems [Invited]," Photonics North (Jun 2015).

D. Nikolova, S. Rumley, D. M. Calhoun, Q. Li, R. Hendry, P. Samadi, K. Bergman, "Scaling silicon photonic switch fabrics for data center interconnection networks," Optics Express 23 (2) pp.1159-1175 (2015).

Q. Li, Y. Liu, K. Padmaraju, R. Ding, D. F. Logan, J. J. Ackert, A. P. Knights, T. Baehr-Jones, M. Hochberg, K. Bergman, "A 10-Gb/s Silicon Microring Resonator-Based BPSK Link," IEEE Photonics Technology Letters 26 (18) (Sep 2014).

Y, Yang, C. Galland, Y. Liu, K. Tan, R. Ding, Q. Li, K. Bergman, T. Baehr-Jones, M. Hochberg, "Experimental demonstration of broadband Lorentz non-reciprocity in an integrable photonic architecture based on Mach-Zehnder modulators," Optics Express 22 (14) (Jul 2014).

Y. Liu, R. Ding, Y. Ma, Y. Yang, Z. Xuan, Q. Li, A. E. Lim, G. Q. Lo, K. Bergman, T. Baehr-Jones, M. Hochberg, "Silicon Mod-MUX-Ring transmitter with 4 channels at 40 Gb/s," Optics Express 22 (13) (Jul 2014).

R. Ding, Y. Liu, Q. Li, Y. Yang, Y. Ma, K. Padmaraju, A. E. Lim, G. Q. Lo, K. Bergman, T. Baehr-Jones, M. Hochberg, "Design and characterization of a 30-GHz bandwidth low-power silicon traveling-wave modulator," Optics Communications 321 124-133 (Jun 2014).

R. Ding, Y. Liu, Y. Ma, Y. Yang, Q. Li, A. E. Lim, G.-Q. Lo, K. Bergman, T. Baehr-Jones, M. Hochberg, "High-Speed Silicon Modulator With Slow-Wave Electrodes and Fully Independent Differential Drive," IEEE/OSA Journal of Lightwave Technology 32 (12) (Jun 2014).

R. Ding, Y. Liu, Q. Li, Z. Xuan, Y. Ma, Y. Yang. A. Eu-Jin Lim, G.-Q. Lo. K. Bergman, T. Baehr-Jones, M. Hochberg, "A Compact Low-Power 320-Gb/s WDM Transmitter Based on Silicon Microrings," IEEE Photonics Journal 6 (3) (Jun 2014).

Y. Liu, R. Ding, Q. Li, Y. Ma, Y. Yang, A. Eu-Jin Lim, G. Luo, K. Bergman, T. Baehr-Jones and M. Hochberg, "40-Gb/s Silicon Modulators for Mid-Reach Applications at 1550 nm," IEEE Optical Interconnects Conference MC4 (May 2014).

Y. Liu, R. Ding, Q. Li, X. Zhe, Y. Li, Y. Yang, A. E. Lim, P. G. Lo, K. Bergman, T. Baehr-Jones, M. Hochberg, "Ultra-compact 320 Gb/s and 160 Gb/s WDM transmitters based on silicon microrings," Optical Fiber Conference (OFC) 2014 Th4G.6. (Mar 2014).

Q. Li, K. Padmaraju, D. Logan, J. Ackert, A. Knights, K. Bergman, "A Fully-integrated In-band OSNR Monitor using a Wavelength-tunable Silicon Microring Resonator and Photodiode ," Optical Fiber Conference (OFC) 2014 W3E.5 (Mar 2014).

Q. Li, Y. Liu, K. Padmaraju, R. Ding, D. Logan, J. Ackert, A. Knights, T. Baehr-Jones, M. Hochberg, K. Bergman, "10-Gb/s BPSK link using Silicon Microring Resonators for Modulation and Demodulation," Optical Fiber Conference (OFC) 2014 Tu2E.5 (Mar 2014).

C. Galland, A. Novack, Y. Liu, R. Ding, M. Gould, T. Baehr-Jones, Q. Li, Y. Yang, Y. Ma, Y. Zhang, K. Padmaraju, K. Bergmen, A. E. Lim, G. Q. Lo, M. Hochberg, "Systems and Devices in a 30 GHz Silicon-om-insulator Platform," European Conference on Optical Communications (ECOC) 2013 Mo.3.B.2 (Sep 2013).

A. Novack, Y. Liu, R. Ding, M. Gould, T. Baehr-Jones, Q. Li, Y. Yang, Y. Ma, Y. Zhang, K. Padmaraju, K. Bergmen, A. E. Lim, G. Q. Lo, M. Hochberg, "A 30 GHz Silicon Photonic Platform," THE 10TH INTERNATIONAL CONFERENCE ON GROUP IV PHOTONICS (GFP) WA4 (Aug 28, 2013).

M. Streshinsky, A. Novack, Y. Liu, R. Ding, M. Gould, T. Baehr-Jones, Q. Li, Y. Yang, Y. Ma, Y. Zhang, K. Padmaraju, K. Bergman, A. Eu-Jin Lim, L. Guo-Qiang, M. Hochberg, "A 30 GHz Silicon Photonic Platform: Multi-Project Wafer Shuttles for Next-Generation Optical Systems [invited]," 2013 IEEE PS Summer Topicals (Jul 2013).

C. Galland, A. Novack, Y. Liu, R. Ding, M. Gould, T. Baehr-Jones, Q. Li, Y. Yang, Y. Ma, Y. Zhang, K. Padmaraju, K. Bergmen, A. E. Lim, G. Q. Lo, M. Hochberg, "A CMOS-compatible silicon photonic platform for high-speed integrated opto-electronics [invited]," Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II 87670G (May 2013).