AIM Test, Assembly and Packaging (TAP)

The AIM Test Project seeks to develop cutting-edge testing solutions for the field of silicon photonics. The focus is the implementation of an automated, switch-centered testing approach for chip, wafer and package-level photonic devices. To this end, the Testing team at the Lightwave Research Laboratory has constructed software framework for controlling automated functional test tools (Prober Control), designed and verified a new approach for wafer-scale optical probing, and developed innovative photonic component measurement strategies.

Lightwave research lab. has driven functional testing efforts for the TAP Hub since 2016. Columbia’s main responsibilities include providing technical support during the equipment procurement process, and the development of the complete automated functional test platform design for implementation, control, and user access at the TAP Hub. We have further trained TAP Hub engineers on the platform. The switch centered
architecture consists of a rack of test and measurement equipment interconnected via RF or optical switch and automated control plane software to the prober system.

Photonic integrated circuits (“PICs”) are projected to scale into dense circuits with hundreds or thousands of elements in the near future. Automated testing of these increasingly complex PICs is a key challenge for the functional testing efforts at the AIM Photonics TAP Hub. A critical aspect is the identification of known good die at the wafer scale. To accomplish this goal, we will work in partnership with Cisco to develop a set of test structures implemented within the dicing channels. The test set and automated electro-optic testing script pass-criteria will provide a platform for performing automated wafer scale functional testing to identify and map validated good dies.