Editor's note:
Our Nature Photonics paper, "Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links", was published on March 21, 2025.
March 21, 2025
Columbia Engineering featured an article about our recent Nature Photonics paper “3D Photonics for Ultra-Low Energy, High Bandwidth-Density Chip Data Links”. In this paper, the Lightwave Research Group demonstrated "a 3D photonic-electronic platform that achieves unprecedented energy efficiency and bandwidth density, paving the way for next-generation AI hardware."
We reported a bandwidth of 800 Gb/s, with an energy consumption of only 120 femtojoules per bit. The package achieves a bandwidth density of 5.3 Tb/s/mm², which exceeds the current state-of-the-art.