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The Lightwave Research Laboratory is involved with multiple research programs on optical interconnection networks for advanced computing systems, data centers, optical packet-switched routers, and nanophotonic networks-on-chip for chip multiprocessors. We are developing a new class of nanoscale photonic interconnect technologies that seamlessly move data from on-chip networks, across memory and large computing systems with extreme energy efficiency. These future platforms, driven by nanophotonic-enabled interconnectivity, and the enormous bandwidth advantage of dense wavelength division multiplexing, will fundamentally transform the computation-communications architecture, to create systems able to meet explosive information demands at all scales.

With the growing demand for photonics based technologies in data centers and high performance computing applications, the Lightwave Research Laboratory aims to be on the cutting edge of research while creating feasible and deployable solutions to tackle real challenges faced in industry. 

• Efficient and Compact Multimode Interior-Ridge Heater for DWDM Systems

• Path Divertibility in a Spatial- and Wavelength-Selective Switching Fabric

• Automated Routing of a Spatial-and-Wavelength Selective Switching Fabric

• Photonic Analog-to-Digital Architecture for Accelerating Multiply-Accumulate Operations

• Dispersion-Engineered Resonator-Based Interleaver Co-Designed with Kerr Comb Source

• Tapered-Hybrid Bend, Interior-Ridge Modulator and Filter Supporting Tbps-Scale Links

• Order-Preserving Channel Calibration of Kerr Comb–Driven Microresonator-Based DWDM Link

• Flexible Photonic Memory Pooling Architecture For Efficient Compute Resource Allocation

• Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links

• Silicon Photonic Integration of DWDM and Mode-Division Multiplexing for Advancing Multi-Dimensional Data Transmission

• FPGA-Programmable 512 Gbps 2.5D DWDM Photonic Network Interface Card

• Wide Spectral Modulation in Highly Efficient Thermally Undercut Foundry Fabricated Resonant Modulators

• Ultra-Wide FSR Vertical-Junction Microdisk Modulator With Efficient External Heater

Columbia Engineering Highlights Our Nature Photonics Paper

Our paper, "Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links", was highlighted in a recent article by Columbia Engineering. This paper demonstrated an 800 Gb/s, 120 femtojoules per bit, 5.3 Tb/s/mm² bandwidth density 3D photonic-electronic package.

Professor Bergman named 2025 C.E.K. Mees Medal Recipient by Optica

Optica announced that Professor Bergman has been selected as the 2025 recipient of the C.E.K. Mees Medal, an award which "recognizes an original use of optics across multiple fields". She is being honored for her pioneering research on optical interconnects and photonic architectures for high-performance computing.

Songli Wang Interviewed by Columbia Engineering

PhD student Songli Wang was interviewed by Columbia Engineering about his summer 2024 internship at Intel, where he worked on silicon photonic switches with the Silicon Photonics Research Team.

Second Annual CUbiC Review Hosted at Columbia

Prof. Bergman and the Lightwave Research Laboratory hosted the second annual review of the Center for Ubiquitous Connectivity (CUbiC) on June 27-28, 2024. Representatives of participating labs and members of industry discussed advancements in energy efficiency, disruptive innovation, and the center's support for the next generation of the semiconductor workforce. Prof. Bergman is the CUbiC director.

Professor Bergman Interviewed by 3D InCites Podcast at ECTC 2024

Prof. Bergman was recently interview by the 3D InCites Podcast during ECTC 2024, where she discussed the role photonics can play in solving the AI energy problem, as well as the new generation of integrated photonics packaging. 

Professor Bergman Interviewed by Laser Focus World to Discuss Co-packaging

Prof. Bergman recently spoke with Laser Focus World's senior technical editor about her keynote address at IEEE’s 74th Electronics and Components Technology Conference (ECTC), and discussed the challenges of co-packaging electronics and photonics.